Using Simulation-based Approach to Ensure Power Integrity and Reliability of SoC and System

The use of advanced technologies such as FinFETs enables higher levels of integration, allowing designers to pack more functionality into a single SoC — functions that were once on separate components such as GPS, graphics, computers, phone, RF, etc. These devices operate at lower supply voltages, reducing the available noise margin. At the same time, these devices drive more current and are packed more closely together, resulting in increased current density, and consequently more noise and reliability issues. FinFET devices also generate more heat compared to planar transistors due to poor heat dissipation, and that, along with higher device density, can cause thermal reliability issues which impacts electromigration (EM). Electrostatic discharge (ESD), electromagnetic interference (EMI) and electromagnetic compatibility (EMC) are additional reliability concerns that need to be addressed as SoCs and systems increase in complexity. These challenges continue to grow as designs migrate to stacked-dies.